Submissions
Sorted by Number
- 1 [Liou]
[pdf] Evolution, Current Status and Future Trend of RF Transistors
- 2 [Jungemann]
[pdf] Noise Analysis for a SiGe HBT by Hydrodynamic Device Simulation
- 3 [Weber]
[pdf] Knowing the Key Factors in RF Power Amplifier Design
- 4 [Kuo]
[pdf] Compact LDD/FD SOI CMOS Device Model Considering Energy Transport and Self Heating for SPICE Circuit Simulation
- 5 [Chew]
[pdf] Impact of Deep N-well Implantation on Substrate Noise Coupling and RF Transistor Performance for Systems-on-a-Chip Integration
- 6 [Kotov]
[pdf] Tunneling Phenomenon in SuperFlash Cell
- 7 [Shimizu]
[pdf] Design Sensitivity in Quasi-One-Dimensional Silicon-Based Photonic Crystalline Waveguides
- 8 [Chen]
[pdf] Failure Characterization of ESD Damage in Low Temperature Poly-Si TFTs
- 9 [Nakajima]
[pdf] Off-Leakage and Drive Current Characteristics of Sub-100-nm SOI MOSFETs and Impact of Quantum Tunnel Current
- 10 [Zimmermann]
[pdf] Fast CMOS-Integrated Finger Photodiodes for a Wide Spectral Range
- 11 [Tsuchiya]
[pdf] Evaluation of Interface Trap Density in a SiGe/Si Heterostructure Using a Charge Pumping Technique and Correlation between the Trap Density and Low Frequency Noise in SiGe-Channel pMOSFETs
- 12 [Kuo2]
[pdf] Compact Breakdown Model for PD SOI NMOS Devices Considering BJT/MOS Impact Ionization for SPICE Circuit Simulation
- 13 [Prgaldiny]
[pdf] A New Physical Modeling of Parasitic Capacitances of Deep-Submicron LDD MOSFETs
- 14 [Soree2]
[pdf] Dissipative transport in quantum wires
- 15 [Sadovnikov]
[pdf] Influence of the Extrinsic Base on the Base Current Kink in SiGe BJTs
- 16 [Bechtold2]
[pdf] Automatic Order Reduction of Thermo-Electric Models for MEMS: Arnoldi versus Guyan
- 17 [Rengel]
[pdf] Static and RF behaviour of short-gate Fully-Depleted Silicon-on-Insulator MOSFETs: numerical and experimental analysis
- 18 [Hakim3]
[pdf] Small Signal Characterization of Thin Film Single Halo SOI MOSFET For Mixed Mode Analog and Digital Applications
- 19 [Rubaldo]
[pdf] Hot carrier reliability improvement of PMOS I/O's transistor in advanced CMOS technology
- 20 [Cacciato]
[pdf] Reduction of Bitline to Control Gate leakage for improved embedded 0.18 um FLASH Yield and Reliability
- 21 [Choi]
[pdf] Reverse-Order Source/Drain (R-S/D) Combined with LDD Offset Spacer and Its Application to 50nm Physical-Gate-Length nMOSFETs
- 22 [Joseph]
[pdf] Comments on Existing 1/f Noise Models:Spice, HSPICE and BSIM3v3 for MOSFETs in Circuit Simulators
- 23 [Schambach]
[pdf] Micromachined Mercury Sensor
- 24 [Lugstein]
[pdf] Post-Process CMOS Front End Engineering With Focused Ion Beams
- 25 [MonzioCompagnoni]
[pdf] Degradation Dynamics for Deep Scaled p-MOSFET's during Hot-Carrier Stress
- 26 [Hehemann]
[pdf] A CMOS Photodiode Array with Linearized Spectral Response and Spatially Distributed Light Intensity Detection for the Use in Optical Storage Systems
- 27 [pascal]
[pdf] Nano crystal memory devices characterization using the charge pumping technique
- 28 [Pichler]
[pdf] Properties of Vacancies in Silicon Determined from Laser--Annealing Experiments
- 29 [Toita]
[pdf] Gate and Drain Bias Dependences of 1/f Noise Amplitude in MOSFETs in the Linear and Saturation Regions
- 30 [Lander]
[pdf] A Tuneable Metal Gate Work Function Using Solid State Diffusion of Nitrogen
- 31 [Roccaforte]
[pdf] High reproducible ideal SiC Schottky rectifiers by controlling surface preparation and thermal treatments
- 32 [SansigoloLujan]
[pdf] Impact of ALCVD and PVD Titanium Nitride Deposition on Metal Gate Capacitors
- 33 [Elattari]
[pdf] Self-Consistent Solution of the Schrodinger and Poisson Equations for Accumulated MOS Capacitors with Ultra-thin Layers
- 34 [Bauza4]
[pdf] Extraction of Si-SiO2 interface trap densities in MOSFET's with oxides down to 1.3 nm thick
- 35 [Roncaglia]
[pdf] Modeling of Large-Area nMOS Devices for Smart-Power Applications
- No paper 36
- 37 [Mahapatra]
[pdf] Performance and reliability of high density flash EEPROMs under CHISEL programming operation
- 38 [Gnani]
[pdf] Extraction method for the impact-ionization multiplication factor in silicon at large operating temperatures
- No paper 39
- 40 [Kwon]
[pdf] Improved Isolated RESURF Technology for a Multi Power BCD Process
- 41 [Chen3]
[pdf] Threshold Variations for Undoped Double-Gate MOSFET's
- 42 [Sadovnikov2]
[pdf] Effects of Boron and Germanium Base Profiles on SiGe and SiGe:C BJT Characteristics
- 43 [Dosev]
[pdf] Simulation and Modeling of Nanocrystalline Silicon Thin Film Transistors
- 44 [Coppens]
[pdf] Ar Sputter Etch to Improve the Insulator Quality in Metal Capacitors
- 45 [Aresu]
[pdf] SILC Measurements of Thin SiO2 at Low Voltages: High-resolution measurements and interpretation
- 46 [Matsumoto]
[pdf] Design Guidelines for Linear Amplification and Low-insertion loss in 5-GHz-band SOI Power MOSFETs
- 47 [Ghetti]
[pdf] Coupled Monte Carlo Simulation of Si and SiO2 Transport in MOS Transistors
- 48 [Kerner]
[pdf] Metal Rings as Quantum Bits
- 49 [Peng]
[pdf] An Ultra-Thin Polycrystalline-Silicon Thin-Film Transistor with SiGe Raised Source/Drain
- 50 [Henson]
[pdf] Investigation of performance improvement and gate-to-junction leakage reduction for the 90nm CMOS gate stack architecture
- 51 [Fatkhoutdinov2]
[pdf] Impact of Post Metal Etch Resist Strip in Plasma on Plasma Charge-Induced Erosion of Tungsten-Plugs
- 52 [Reisch]
[pdf] High-Frequency Bipolar Transistor Noise Modeling
- 53 [Moens]
[pdf] Future Trends in Intelligent Interface Technologies for 42V Battery Automotive Applications
- 54 [Kwon2]
[pdf] Suppression of CoSix Induced Leakage Current using Novel Capping Process for Sub-0.10um node SRAM Cell technology
- 55 [Lukyanchikova]
[pdf] On the origin of the 1/f1.7 noise in deep submicron partially depleted SOI transistors
- 56 [Ielmini]
[pdf] Monitoring Flash EEPROM Reliability by Equivalent Cell Analysis
- 57 [LEE]
[pdf] Fabrication of 0.1-um pMOSFETs with SiGe-Channel and Elevated B-Doped SiGe Source and Drain Layers
- No paper 58
- 59 [WC3]
[pdf] Temperature-Dependent Characteristics of an n+-InGaAs/n-GaAs Composite Doped Channel (CDC) Heterostructure Field-Effect Transistor
- 60 [Rhayem]
[pdf] Impact of Scaling Down from 0.25um to 0.18um CMOS Technology on 1/f Noise: Characterisation and Modelling
- 61 [WC4]
[pdf] On the n+-GaAs/p+-InGaP/n--GaAs High-Barrier Camel-Like Gate Transistor for High-Breakdown, Low-Leakage and High-Temperature Operations
- 62 [Rucker3]
[pdf] Antimony as Substitute for Arsenic to Eliminate Enhanced Diffusion Effects
- 63 [HM]
[pdf] An InGaP/GaAs Resonant-Tunnelling Bipolar Transistor (RTBT) with Multiple Negative-Differential-Resistance (MNDR) Phenomena
- 64 [KB]
[pdf] Characteristics of Polysilicon Resistors for Sub-Quarter Micron CMOS Applications
- 65 [Dimitri]
[pdf] Clamped-Clamped Beam Micro-Mechanical Resonators in Thick-Film Epitaxial Polysilicon Technology
- 66 [Zhang]
[pdf] A Viable Self-aligned Bottom-Gate MOSFET Technology for High Density and Low Voltage SRAM
- 67 [Chimenton]
[pdf] Impact of Tunnel Oxide Thickness on Erratic Erase in Flash Memories
- 68 [Abdelkarim]
[pdf] Inversion Layer Quantization Impact on the Interpretation of 1/f Noise in Deep Submicron CMOS Transistors
- 69 [Jankovic2]
[pdf] Variable-Gain Inversion Layer Emitter Phototransistor in CMOS Technology
- 70 [Caputo]
[pdf] Effect of Pulsed Stress on Leakage Current In MOS Capacitors For Non-Volatile Memory Applications
- 71 [deCesare]
[pdf] LOW PINCH-OFF VOLTAGE AMORPHOUS SILICON JUNCTION FIELD-EFFECT TRANSISTOR: SIMULATION AND EXPERIMENT
- 72 [Sakalas]
[pdf] Microwave noise Modeling of the 0.18um Gate Length Mosfets with a 60GHz cut-off frequency
- 73 [Kunz]
[pdf] Reduction of parasitic capacitance in vertical MOSFET's by fillet local oxidation (FILOX)
- 74 [Ragi]
[pdf] Modeling the C-V Characteristics of Heterodimensional Schottky Contacts
- 75 [Kunz4]
[pdf] Application of Polycrystalline SiGe for Gain Control in SiGe Heterojunction Bipolar Transistors
- 76 [Malik]
[pdf] Photoelectric and Tensometric Properties of a Metal Phthalocyanine-Silicon Junctions
- 77 [Sorge]
[pdf] Implantation Dose Profiling by MOS C-V Measurements
- 78 [Baek2]
[pdf] Characteristics of HfO2 pMOSFET with ultrashallow junction prepared by plasma doping and laser annealing
- 79 [Wang]
[pdf] Compact Quantum Mechanical Device Models for MOSFETs in Gigascale Integration(GSI)
- 80 [Gehring2]
[pdf] Transmission Coefficient Estimation for High-K Gate Stack Evaluation
- 81 [Cowern]
[pdf] Diffusion Suppression in Silicon by Substitutional C Doping
- 82 [Stojcevski]
[pdf] Low Power, 3-bit CMOS Pipeline ADC with Reduced Complexity Flash Architecture
- 83 [Ryzhii]
[pdf] Device Model of Integrated QWIP-HBT-LED Pixel for Infrared Focal Plane Arrays
- 84 [Poyai]
[pdf] Impact of p-Well Implantation Parameters on Junction Leakage
- 85 [Paschen]
[pdf] High Temperature CMOS Process with Dielectric Isolation
- 86 [Dubois]
[pdf] Impact of source/drain implants on threshold voltage matching in deep sub-micron CMOS technologies
- 87 [Fix]
[pdf] Fast polymer integrated circuits based on a polyfluorene derivative
- 88 [Lee2]
[pdf] Highly Extendible Memory Cell Architecture for Reliable Data Retention Time for 0.10mm Technology Node and beyond
- 89 [Rantzer]
[pdf] Deep Trap Modelling and Transient Measurements of a-Si:H p-i-n Diodes
- 90 [Bagnoli]
[pdf] Study of Hot-spot Phenomena in Cellular Power Transistors by Analytical Electro-Thermal Simulation
- 91 [Alessandria]
[pdf] Integrated Si-based Opto-Couplers: a Novel Approach to Galvanic Isolation
- 92 [Brezeanu3]
[pdf] Numerical and Analytical Study of 6H-SiC Detectors with High UV Performance
- No paper 93
- 94 [Gloesekoetter]
[pdf] Pseudo Dynamic Gate Design based on the Resonant Tunneling-Bipolar Transistor (RTBT)
- 95 [Frere]
[pdf] A New Improved Model for LDMOS Transistors under Different Gate and Drain Bias Conditions
- 96 [Horstmann]
[pdf] Lithography Independent Fabrication of Nano-MOS-Transistors with W = 25 nm and L = 25 nm
- 97 [Donaghy]
[pdf] Investigating 50nm channel length vertical MOSFET containing a dielectric pocket, in a circuit environment
- 98 [Pogany]
[pdf] A method for extraction of power dissipating sources from interferometric thermal mapping measurements
- 99 [Bakeroot]
[pdf] Cost Effective Implementation of a 90 V RESURF P-type Drain Extended MOS in a 0.35 um Based Smart Power Technology
- 100 [Liu]
[pdf] Characteristics of Sub-100nm High-k Gate Dielectrics MOSFETs With Different Source/Drain Structure
- 101 [Kikuchi2]
[pdf] Stability of High-k Thin Films for Wet Process
- 102 [Heiskanen]
[pdf] Implementing Self-Heating Effects into a Volterra Simulator
- 103 [Arshak]
[pdf] Thick Film Gamma Radiation Sensors with Sensitive Layers of NiO and La2O3–Fe2O3 Mixture
- 104 [RJohannes]
[pdf] Scaling considerations for fully-depleted SOI transistors down to the 20nm gate length regime
- 105 [Akama]
[pdf] Stability of High-k Thin Films in Moisture Ambience - The Effect of Dissolution Gas from Acryl Apparatus -
- 106 [Yamamoto]
[pdf] Electrical Characteristics Improvement of Dy2O3 Thin Films by In-situ Vacuum Anneal
- 107 [Ackaert2]
[pdf] Use of Oxynitride Dielectric to Maximise the Growth Rate of Selective Epitaxial Base Layer in a Self-Aligned Double-Polysilicon SiGe Bipolar Transistors
- 108 [Taguchi]
[pdf] Annealing Condition Dependence of Electrical Characteristics.
- 109 [Vandenbosch]
[pdf] Identification of Critical Parameters for Plasma Process-Induced Damage in 130 and 100 nm CMOS Technologies
- 110 [Hofmann]
[pdf] Passive DNA Sensor with Gold Electrodes Fabricated in a CMOS Backend Process
- 111 [Ohshima]
[pdf] Electrical Characteristics of Gd2O3 thin film deposited on Si substrate.
- 112 [Rosmeulen2]
[pdf] Electrical Characterisation of Silicon-Rich-Oxide Based Memory Cells Using Pulsed Current-Voltage Techniques
- 113 [Kashiwagi]
[pdf] Characteristics of High-k Gd2O3 Films Deposited on Different Orientation of Si Substrate
- 114 [LeRoyer]
[pdf] Accurate modeling of Quantum-Dot based Multi Tunnel Junction Memory: Optimization and process dispersions analyzes for DRAM applications
- 115 [Schenkel]
[pdf] TCAD Based Design Methodology for Substrate Current Control in Smart Power ICs
- 116 [Khlyap]
[pdf] Numerical simulation of parameters of ZnCdHgTe films and
- 117 [Scheinert]
[pdf] Simulated influence of bulk traps on the subthreshold characteristics of an organic field effect transistor
- 118 [Brederlow]
[pdf] Investigation of the Thermal Noise of MOS Transistors under
- 119 [Oulmane]
[pdf] Accurate Delay Metric for On-chip Resistive Interconnect
- 120 [Hisamitsu]
[pdf] Temperature-Independence-Point Properties for 0.1um-scale Pocket-Implant Technologies and the Impact on Circuits Design
- 121 [Dieudonn]
[pdf] Low frequency noise in 0.12 µm Partially and Fully Depleted SOI technology
- 122 [Wilson]
[pdf] A 12Volt, 12GHz Complementary Bipolar Technology for High Frequency Analogue Applications
- 123 [RichardsJr]
[pdf] Comparison of the Gate Tunneling Current in Ultrathin-Oxide Inversion and Accumulation MOSFETs
- 124 [Vermandel]
[pdf] Optimising High-Voltage Devices in a Smart Power Technology, using the RESurF-effect and TCAD.
- 125 [DellaCorte]
[pdf] Design and simulation of an a-Si:H/GaAs heterojunction bipolar transistor
- 126 [Cubaynes]
[pdf] Gate dielectrics for high performance and low power CMOS SoC applications
- 127 [Grgec]
[pdf] Efficient Monte Carlo Simulation of Tunnel Currents in MOS Structures
- 128 [Nguyen]
[pdf] Improved Modified Local Density Approximation for the Modeling of Size Quantization in pMOSFETs
- 129 [Maget]
[pdf] Voltage-controlled substrate structure for integrated inductors in standard digital CMOS technologies
- 130 [Huang]
[pdf] Temperature Effects of Low Noise InGaP/InGaAs/GaAs PHEMTs
- 131 [LeMinh]
[pdf] Monolithic Integration of a Novel Microfluidic Device with Silicon Light Emitting Diode-Antifuse and Photodetector
- 132 [Mahapatra2]
[pdf] Quasi-analytical modelling of drain current and conductance of Single Electron Transistors with MIB
- 133 [Pascal]
[pdf] Gate Material Properties Induced 0.25µm SRAM Marginality
- 134 [Croon]
[pdf] Influence of Doping Profile and Halo Implantation on the Threshold Voltage Mismatch of a 0.13um CMOS Technology
- 135 [Fraboulet]
[pdf] Coulomb Blockade in Thin SOI Nanodevices
- 136 [Brown]
[pdf] Mixing Sources of Intrinsic Parameter Fluctuations in the Simulation of Sub-100nm MOSFETs
- 137 [Straube]
[pdf] SiGe pMOSFETs Fabricated on Novel SiGe Virtual Substrates Grown on 10µm x 10µm Pillars.
- 138 [Aarts]
[pdf] A Robust and Physically Based Compact SOI-LDMOS Model
- 139 [Castagna]
[pdf] Quantum Dot Materials and Devices for Light Emission in Silicon
- 140 [Wu]
[pdf] Improved Compact RF-Noise Modelling for Deep Sub-Micron MOSFETs
- 141 [Vieregge]
[pdf] Reducing the Threshold Voltage Deviation for sub-100nm Transistors using Midbandgap-Gatematerials
- No paper 142
- 143 [Reggiani]
[pdf] Electron Transport in Semiconductor-Insulator Structures Using
the Full-Band Dispersion Relation of Si and SiO2
- No paper 144
- 145 [JOSSE]
[pdf] Spike anneal optimization for digital and analogue high performance 0.13 µm CMOS platform
- 146 [Morillon]
[pdf] Realization of a SCR on an Epitaxial Substrate Using Al Thermomigration
- 147 [REYTAURIAC2]
[pdf] Process and device simulation of power VDMOS transistors in Bipolar/CMOS/DMOS technology
- 148 [Laurent]
[pdf] Engineering of 80V Vertical n-DMOS in a 0.35um CMOS Technology
- 149 [Kalna]
[pdf] Tunnelling and impact ionization in scaled double doped PHEMTs
- 150 [mariucci]
[pdf] Mechanisms of dopant redistribution and retention in Silicon following ultra-low energy Boron implantation and excimer laser annealing
- 151 [ANGHEL]
[pdf] Universal Test Structure and Characterization Method for Bias-Dependent Drift Series Resistance of HV MOSFETs
- 152 [Daliento]
[pdf] A New Test Structure for In-situ Measurements of interface Recombination During Surface Treatments
- 153 [Sturm]
[pdf] Integrated Photodiodes in Standard BiCMOS Technology
- 154 [schwantes]
[pdf] impact of statistical threshold voltage fluctuation and quantum mechanical effects on cmos circuits with gigabit feature size
- 155 [Schulz]
[pdf] Impact of technology parameters on inverter-delay of UTB-SOI CMOS
- 156 [Kundu]
[pdf] Electron Transit Time Enhancement In Photodetectors For High Speed Imaging
- No paper 157
- 158 [schwantes2]
[pdf] impact of stochastic dopant variation and the copper size effect on gigascale integration
- 159 [Cola]
[pdf] Photodetector with Internal Aiding Field Based-on GaAs/AlGaAs Heterostructures
- 160 [Schwalke]
[pdf] Process Integration of Crystalline Pr2O3 High-k Gate Dielectrics
- 161 [Zan]
[pdf] Novel small-dimension poly-Si TFTs with improved driving current and suppressed short channel effects
- 162 [Wang2]
[pdf] Accurate Modelling of Thin-Film Resistor up to 40 GHz
- 163 [Das]
[pdf] Effect of annealing on wet oxidation of AlxGa1-xAs Layer
- 164 [Olsen]
[pdf] Si/SiGe Cross-hatching: a Good Indicator of Strained Si MOSFET Performance
- 165 [Li]
[pdf] Ultra-Thin Oxide Lifetime Estimation Using Transistor Degradation
- 166 [Axelrad]
[pdf] Efficient Analysis and Optimization of ESD Protection Circuits
- 167 [Mahapatra3]
[pdf] Substrate bias effect on cycling induced performance degradation of Flash EEPROMs
- 168 [Dixit]
[pdf] A Novel Dynamic Threshold Operation Using the Electrically Induced Junction MOSFET in the Deep Sub-micrometer CMOS Regime
- 169 [Basset]
[pdf] Design of a Remote Control System for a Wireless Microrobot
- 170 [Malik2]
[pdf] Optoelectronics properties of FTO/SRO/Si radiation sensors
- 171 [Kim2]
[pdf] The Advanced RESURF Structure to improve On-Resistance in BCDMOS
- 172 [Tartagni]
[pdf] A Comparative Analysis of Active and Passive Pixel CMOS Image Sensors
- 173 [Specht]
[pdf] Simulation of high-K tunnel barriers for nonvolatile floating gate memories
- 174 [Nguyen2]
[pdf] Through-Wafer Copper Electroplating for RF Silicon Technology
- 175 [Amakawa]
[pdf] A new approach to failure analysis and yield enhancement of very large-scale integrated systems
- 176 [IcazaDeckelmann]
[pdf] UIS-Failure of DMOS Power Transistors
- 177 [Kang2]
[pdf] Fabrication and Experimental Results of Lateral Trench Electrode IGBT
- 178 [Jurczak]
[pdf] Elevated Co-Silicide for sub-100nm High Performance and RF CMOS
- 179 [Ingrosso]
[pdf] Monte Carlo Simulation of Program and Erase Charge Distributions in NROM(TM) Devices
- 180 [Tavel]
[pdf] Investigations on Poly-SiGe gate in full 0.1µm CMOS integration
- 181 [Kolhatkar]
[pdf] Constant and Switched Bias Low Frequency Noise in p-MOSFETs with Varying Gate Oxide Thickness
- 182 [Avellan]
[pdf] Temperature dependence of the hard breakdown current of MOS capacitors
- 183 [Barraud]
[pdf] Effects of random discrete impurities in ultra-short MOSFET using 3D Monte Carlo simulation
- 184 [Moroz]
[pdf] Exploring Methods for Adequate Simulation of Sub-100nm Devices
- 185 [Gopinath2]
[pdf] Effects of Stress-Induced Bandgap Narrowing on Reverse-Bias Junction Behavior
- 186 [Gopinath]
[pdf] A Simple and Accurate HSPICE Compatible Gate Leakage Macro Model
- 187 [Kim3]
[pdf] A Low On-Resistance 700V Charge Balanced LDMOS with Intersected WELL Structure.
- No paper 188
- 189 [Kim4]
[pdf] A New Latch-Up Free Complementary Bipolar Process using PBSOI Technique
- 190 [TorresTorres2]
[pdf] A New S-parameter Measurement-Based Method for MOSFET Gate Resistance Extraction
- 191 [Kim5]
[pdf] High performance 0.1um CMOS device with suppressed parasitic junction capacitance and junction leakage current
- 192 [Singh]
[pdf] Scaling Behaviour of Large-grain Polysilicon MOSFETs
- 193 [jeremy]
[pdf] New mechanism of body charging in partially depleted SOI-MOSFETs with ultra-thin gate oxides
- 194 [Arnaud]
[pdf] Channel architecture optimisation to reduce RNCE of deep sub-micron devices
- 195 [Arnaud2]
[pdf] Gate oxide process impact on RNCE for advanced CMOS transistors
- 196 [Obreja2]
[pdf] On the High Temperature Operation of High Voltage Power Devices
- 197 [Park]
[pdf] Lateral Trench Gate Super-Junction SOI-LDMOSFETs with Low On-Resistance
- 198 [RodrguezTorres]
[pdf] Three-Dimensional Analysis of a MAGFET at 300 K and 77 K
- 199 [Kilchytska]
[pdf] Substrate Effects on the Small-Signal Characteristics of SOI MOSFETs
- 200 [Lienemann]
[pdf] Volume shrinking in Micro-Fluidic Self-Assembly
- 201 [Collaert]
[pdf] Influence of the Ge-concentration and RTA on the device performance of strained Si/SiGe pMOS devices
- 202 [Garzella]
[pdf] LaNixFe1-xO3 thin films: p-type ethanol sensors
- 203 [Georges]
[pdf] Channel Engineering Study for 50 nm P-Channel MOSFET
- 204 [David]
[pdf] Raised Source/Drain on 50nm CMOS Circuits : Propagation Delay and Dynamic Power Optimizations
- 205 [Cristoloveanu]
[pdf] The Four-Gate Transistor
- 206 [Jain]
[pdf] A novel, low-power Capacitive waveform transformer
- 207 [Natali]
[pdf] Hybrid metal-organic photodetectors based on a new class of metal-dithiolenes
- 208 [Esseni2]
[pdf] An Improved Model for Electron Mobility Degradation by Remote Coulomb Scattering in Ultra-Thin Oxide MOSFETs
- 209 [Heitzinger]
[pdf] An Algorithm for Smoothing Three-Dimensional Monte Carlo Ion Implantation Simulation Results
- 210 [PERRIN]
[pdf] A Complete Evaluation of Trench Oxide Thickness Effect on Advanced ULSI
- 211 [Hsiung]
[pdf] 50nm Schottky Barrier CMOS with Conventional Silicide
- 212 [XUE]
[pdf] Array-Based Electrical Detector of Integrated DNA Identification System for Genetic Chip Applications
- 213 [Lundgren]
[pdf] A MOS Nanogap Device Structure for Characterisation of Nano-scale Objects
- 214 [Gruhle]
[pdf] The Double-Bandgap-Narrowing Transistor
- 215 [Kaczer]
[pdf] Understanding nMOSFET characteristics after soft breakdown and their dependence on the breakdown location
- 216 [Aderstedt]
[pdf] A Compact Model of the MOS Tunnel Emitter Transistor
- 217 [Sareen]
[pdf] Effect of Si Cap Layer Thickness on Parasitic Channel Operation in SiSiGe MOS Structures
- 218 [Pejnefors]
[pdf] A Self-Aligned Double Poly-Si Process Utilizing Non-Selective Epitaxy of SiGe:C for Intrinsic Base and Poly-SiGe for Extrinsic Base
- 219 [Kang4]
[pdf] The characteristics of leakage current mechanisms and SILC effects of Al2O3 gate dielectric
- 220 [Rantzer2]
[pdf] Bulk Wafer Defects Observable in Vision Chips
- 221 [Carrre]
[pdf] Triple Gate Oxide by Nitrogen Implantation Integrated in a 0.13µm CMOS Flow
- 222 [Jackson]
[pdf] Towards an Integrated Bulk/SOI Active Pixel APD Sensor: Bulk Substrate Inspection with Geiger Mode Avalanche Photodiodes
- 223 [Cuoco]
[pdf] Experimental Verification of the Smoothie Database Model for Third and Fifth Order Intermodulation Distortion
- 224 [MARCON]
[pdf] Determination of beryllium and self-interstitial parameters for modeling of Be activation implanted in InGaAs
- 225 [Coli]
[pdf] Influence of dot size and density on the program characteristics of nanocrystal Flash memories
- 226 [MOUIS]
[pdf] Electron Transport in Nanoscale Double-Gate MOSFETs from Monte-Carlo and Quantum Ballistic Simulation
- 227 [Lindgren]
[pdf] Enhanced intrinsic gain (gm/gd) of PMOSFETs with a Si(0.7)Ge(0.3) channel
- 228 [Mller]
[pdf] Advanced Junction Engineering for 60nm-CMOS Transistors
- 229 [Garros]
[pdf] Investigation of HfO2 dielectric stacks deposited by ALD with a mercury probe
- 230 [Otn]
[pdf] Modeling of Accumulation MOS Capacitors
- 231 [vonHaartman]
[pdf] An experimental study of the influence of channel positioning on low-frequency noise in Si(0.7)Ge(0.3) pMOSFETs
- 232 [Burenkov]
[pdf] Three-dimensional simulation of the channel stop implant effects in sub-quarter micron PMOS transistors
- 233 [Gwoziecki]
[pdf] Physics of the subthreshold slope - initial improvement and final degradation in short CMOS devices
- 234 [Lombardo]
[pdf] Programming by Tunneling in Nanocrystal Memories
- 235 [Nenadovic]
[pdf] High-performance Silicon-On-Glass VDMOS transistor for RF-power applications
- 236 [Heitzinger2]
[pdf] On Increasing the Accuracy of Simulations of Deposition and Etching Processes Using Radiosity and the Level Set Method
- 237 [Frederic2]
[pdf] Gate length scaling in high fMAX Si/SiGe n-MODFET
- 238 [Bidaud]
[pdf] Thermal Nitridation of Chemical Dielectrics as an Easy Approach to Ultra-thin Gate Oxide Processing
- 239 [Tsai]
[pdf] Direct-Current Performance Improvements of Al0.45Ga0.55As/GaAs Digital Graded Superlattice-Emitter Heterojunction Bipolar Transistors by Wet-Oxidation
- 240 [CONTARET2]
[pdf] Conduction and Noise Modelling of Submicronic Devices: Comparison Between ISE-TCAD Software and Microscopic Simulations
- 241 [Venezia]
[pdf] The RF potential of high-performance 100nm CMOS technology
- 242 [Tan2]
[pdf] Reduction of Short-Channel Effects and Improvement in Microwave Characteristics for V-groove Gate Pseudomorphic Doped-Channel HFET with Dual V-groove Gate Structure
- 243 [Ankarcrona]
[pdf] A Novel General Direct Extraction Technique Used For a RF MOSFET Small-Signal Equivalent Circuit
- 244 [vanderWel]
[pdf] Measurement of MOSFET LF Noise Under Large Signal RF Excitation
- 245 [Lartigau]
[pdf] Comparative study of 1/f noise in bulk and SOI MOS devices
- 246 [Koricic2]
[pdf] Investigation of the Extrinsic Base Effect on High Frequency Performance of SOI Lateral Bipolar Transistors (LBT)
- 247 [Augendre]
[pdf] Controlling STI-related parasitic conduction in 90 nm CMOS and below
- 248 [Stellari2]
[pdf] CMOS circuit analysis with luminescence measurements and simulations
- 249 [JOHANSSON]
[pdf] ZrO2 gate dielectrics prepared by e-beam deposition of Zr and YSZ films and post annealing processes
- 250 [Jha2]
[pdf] Optimization of Single Halo p-MOSFET Implant Parameters for Improved Analog Performance and Reliability
- 251 [ABBOUN]
[pdf] Self Heating in InP DHBT Technology for 40 Gb/s ICs
- 252 [Austin]
[pdf] Unified 2D Short Channel Effects Model for Bulk CMOS FETs
- 253 [Clerc]
[pdf] Investigation on Convergence and Stability of Self-Consistent Monte Carlo Device Simulations
- 254 [Giudice]
[pdf] A CMOS Compatible Single-Photon Avalanche Diode
- 255 [Maxim]
[pdf] Physically-Based Matching Model for Deep-submicron MOS Transistors
- 256 [Gerardi]
[pdf] Reliability and Retention Study of Nanocrystal Cell Array
- 257 [Heinle]
[pdf] Vertical high voltage devices on thick SOI with back-end trench formation
- 258 [Fiori]
[pdf] Modeling of ballistic nanoscale MOSFETs
- 259 [Mirabedini]
[pdf] 65 nm Transistors for a 90 nm CMOS SOC Platform
- 260 [Guiducci]
[pdf] A Biosensor for Direct Detection of DNA Sequences Based on Capacitance Measurements
- 261 [Suligoj]
[pdf] A New Compact Horizontal Current Bipolar Transistor (HCBT) Fabricated in (110) Wafers
- 262 [McCarthy]
[pdf] A Novel CMOS Compatible Top-Floating-Gate Flash EEPROM Cell.
- 263 [Froment]
[pdf] Improvement in the prediction of Boron diffusion during a Spike Annealing for Ultra-Shallow Junctions
- 264 [Furuta]
[pdf] Tunnel Barrier Properties of Polycrystalline-Si Single-Electron Transistor
- 265 [Fobelets]
[pdf] Experimental study of depletion mode Si/SiGe MOSFETs for low-temperature operation
- 266 [Staedele]
[pdf] Influence of source-drain tunneling on the subthreshold behavior of sub-10nm double-gate MOSFETs
- 267 [Bourenkov]
[pdf] Benchmarking of Table Methods for MOSFET modelling
- 268 [Redolfi]
[pdf] Improved Deep Sub-micron CMOS Ring Oscillator Performance with n-HDD and n-LDD P+ + As+ Co-Implant
- 269 [Veloso2]
[pdf] RPN Oxynitride Gate Dielectrics for 90 nm Low Power CMOS Applications
- 270 [Zamdmer]
[pdf] Suitability of Scaled SOI CMOS for High-Frequency Analog Circuits
- 271 [Gondro]
[pdf] Influence of the Inner Miller-Effect on the Input Capacitance of CMOS Transistors
- 272 [Lee3]
[pdf] High Hot-Carrier and ESD Immunity Device for High-Voltage I/O NMOSFETs in 0.1-um CMOS Technology
- 273 [Ahmed]
[pdf] Scaling of MOSFET Transconductance with Gate Oxide Thickness and Effect of Remote Charge Scattering
- 274 [Ionescu]
[pdf] A Novel MEMS Technological Platform Aimed at RF Applications
- 275 [Dimitrakis]
[pdf] Si Nanocrystal Based Memory Structures by Ultra Low Energy Implantation for Low Voltage/Low Power Applications
- 276 [Yuan]
[pdf] Source/Drain Parasitic Resistance Role and Electrical Coupling Effect in sub 50nm MOSFET Design
- 277 [Sotiriadis]
[pdf] Fast Algorithm for Clock Grid Simulation
269 papers